Ormecon International is a world-wide operating group of companies with in-depth competence in the area of Immersion Tin as solderable surface finish for printed circuit boards (PCB). With a world-wide customer base of over 120 customers and approx. 25 sales partners, Ormecon International is market leading in the field of Immersion Tin. The Ormecon International group consists of Ormecon GmbH (group head office), Electronic Chemicals Unicron GmbH, both in Germany, and Ormecon CirTech LLC in the USA.

It is expected that the market for Immersion Tin will grow substantially short-term, especially in the course of the international implementation of lead-free technologies/processes, following the Reduction of Hazardous Substances - RoHS directive and Waste Electrical & Electronic Equipment - WEEE directive. Besides this, the further structure miniaturization and high volume production of PCB´s will require advanced alternative surface finishes.

• "In the fast changing Electronics industry, companies must be able to follow the speed of their customers. Ormecon International is dedicated to meet and even outperform its customers needs, to fulfill the present and future requirements of the PCB manufacturers and OEM´s, like offering lead-free processes, support for efficient high volume PCB production, offering package solutions and serving PCB structure miniaturization requirements."
  Michael Letterer
  VP & Managing Director
  Ormecon International

In 2004, Ormecon International will introduce two new Immersion Tin products to the international market: ORMECON CSN FF and ORMECON CSN FF-W. The process development of the two new products is based on the know-how of the Ormecon International group members products (ORMECON CSN, UNICRON and OMIKRON (PLUS)) and the know-how of the technology partners.

Besides the already known key features of Immersion Tin processes, like long-term stable solderable surface finish with a broad process window, low chemicals consumption as well as lead-free technology processing, those two products will offer further key product advantages.

ORMECON CSN FF is designed to be a process with a pretreatment based on the Organic Metal (polyaniline) as stabilizer and catalyst for the following improved tin bath, which as a complete process will have superior features as a high volume applicable surface finish for all kinds of PCB´s.

ORMECON CSN FF-W is designed to be a whisker-reduced process, with basically the same set-up as CSN FF, but additionally including a whisker reducing ingredient. This process will meet the requirements of the PCB applications, with highest reliability and superior performance.

By having these two new products introduced to the world-wide market in 2004, Ormecon International offers key alternative surface finishes against HASL, ENIG and OSP.

To provide an efficient and reliable package for its customers, Ormecon International is cooperating closely with certain equipment manufacturers for co-designing Immersion Tin machinery and processes.

Ammersbek - Germany, February 2004

(Michael Letterer)

For further information please contact
Mr. Michael Letterer at Ormecon GmbH via phone +49-40-604-106-0 or email letterer@ormecon.de .