Solderability is retained for more than 1 year, also in multiple soldering processes. The solder is wetting the side walls of the drilling holes without problems.
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This is achieved by ORMECON® by the ennobling of copper and tin, and because it builds a barrier to decrease interdiffusion of the two metals. The high temperature stability allows to maintain this effect also after aging and multiple soldering.
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thermally aged |
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ORMECON® CSN allows a clean solder process. The use of pure tin results in
solder baths staying free from foreign metals. The ORMECON® layer does not
influence the solder process itself.
The method is simple, and as a basket operation it needs no special investment: a succession of brief immersion steps in aqueous baths.
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In horizontal technique it meets all requirements for a modern automated manufacturing of printed circuit boards.
