An additional annealing step, which can be combined with the hardening of the solder resist mask, is advisable for problematic copper surfaces and for ultra-high
standards. The copper surface is ennobled by ORMECON®, which appears golden or silver-like after tempering.
No hazardous waste is produced. The etch can be regenerated. The ORMECON® immersion bath is refilled and re-activated with a concentrate. The tinning bath can be recycled or disposed like usual chemical baths. But compared to conventional processes it can tin at least 30% more area. The procedure is running at medium temperatures. All this helps to save our environment.
The decisive step into the future - the alternative to HASL -
ORMECON® CSN
The ORMECON® CSN process
contains everything:
Etching - Active Dispersion - Chemical tin bath
It meets all modern requirements for printed circuit boards.
ORMECON® is the first Organic Metal that is commercially available worldwide. It is the product of a 15-year research by Zipperling Kessler & Co., parent organisation of the production company Ormecon Chemie. ORMECON® also opens more potentials for further improvements in the manufacturing of printed circuit boards.
We are glad to advise on all aspects of applications technology.
ORMECON CHEMIE GmbH & Co.,
KG
Ferdinand-Harten-Str. 7, D-22949 Ammersbek
Phone:
+49-40-604 106-0, Fax: +49-40-604 106-51
Internet: http://www.ormecon.de
E-Mail: mailbox@zipperling.hh.uunet.de
