
ORMECON®, the world's first Organic Metal, can replace hot air levelling and solves the problems of immersion tinning procedures.
ORMECON® is the first representative of a completely new class of substances
and combines very unusual properties:
An aqueous dispersion is used to apply an ultra-thin ORMECON® coating (0.08 µm = 80 nanometres) to the copper. This is shifting the chemical potential of copper and ennobles the surface.
ORMECON® prevents copper oxidation and is also the active surface for the
subsequent immersion tinning.
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chemical mechanism of tin deposition tin oxide layer build-up |
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It causes the deposition of pure tin, even when working with used tin baths with high copper content. Compared to usual processes 500% more area can be tinned with the same bath now.
A tin layer of only about 0,7 µm is sufficient. It results in an
absolutely precise planar surface, the basis for a future miniaturisation demand.
Progress in process and basic understanding: IPC conference 1998 on surface finishes