ORMECON^® CSN

The pioneering innovation for modern printed circuit board manufacture

Applied to copper as a wafer-thin coating from an aqueous dispersion, ORMECON^® acts as an active surface for immersion tinning.

The decisive step into the future
- the alternative to HASL -

ORMECON^® CSN: A new dimension for manufacture of modern printed circuit boards.

ORMECON^®, the world's first Organic Metal.

ORMECON^® CSN      The Working Mechanism

ORMECON^® CSN      Solderability

ORMECON^® CSN      ... even more benefits

ORMECON^® CSN      Independent test report

ORMECON^® CSN       another independent test report by Airex

commercial ORMECON^® CSN lines

Reference List

Horizontal Toll Processing

Vertical Toll Processing

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